Advanced Semiconductor Assembly Phils.

Back-end assembly and test for power and analog semiconductor devices.

Advanced Semiconductor Assembly Phils. provides wafer dicing, die attach, wire bonding, and encapsulation for ICs used in automotive and industrial applications. Our Calamba cleanroom operates to Class 100 standards for high reliability. We serve global IDMs and fabless companies with high-volume production.

Type
manufacturer (our classification of the record, not a statement by the company)
Role
Manufacturer
Location
Calamba, Philippines
Founded
2005
Website
asap.com.ph
Categories
Packaging & Printing Supplies
Markets
United States, Japan, South Korea, Taiwan

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